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ANSYS for temperature fields

The ANSYS products for temperature fields allow for temperature analyses across several scales, from microchips to circuit boards to the entire device. In the area of thermal tasks, ANSYS products are used to describe the temperature behavior of components and assemblies under consideration of heat conduction, convection, and radiation.

Typical applications

By maintaining a temperature corridor for electrical components (thermal management), for example in microchips, controllers, transformers, motors, and generators – the service life is extended.

Temperature regulation, such as for sensors, optical systems, or measurement systems, ensures a high level of measurement accuracy for precision components.

A specific design for heating and cooling processes in the production systems like blast furnaces and rolling mills or in systems for plastics processing, food production, and the chemical industry, will optimize energy costs, cycle times, and product characteristics.

Optimizing energy consumption by simulating the temperature distribution for an aluminum electrolysis oven
Source: Hydro

Thermal management in a circuit board

Performance characteristics

Users benefit from specialized workflows for modeling pipe flow without CFD, homogenized thermal conduction models for developing electrical drives, and PCBs (printed circuit boards) without extensive conductor path modeling. Moreover, there are library elements for frequently used components to describe everything from fans with simple characteristic curves to already illustrated CFD models.

Linking spatially distributed sizes, like losses from the magnetic fields for low and high frequency applications or heat transfer coefficients from CFD, forms the basis for a precise model of reality. In many cases, the temperature influences the properties of the raw materials, like electrical resistance, e-module, thermal conductivity, permeability, and coercive force of permanent magnets (example: inductive heating→ factor of 1.0000 in the temperature-dependent permeability). With the bidirectional linking of temperature field and electrical/mechanical/magnetic analysis, ANSYS provides a precise description of such contexts. Methods for model order reduction (MOR) return behavior models that efficiently model the characteristic behavior in system considerations and thus allow for the coordination of various components with each other.

ANSYS Modules

In order to effectively study the relevant phenomena, the degree of detail and the work process for the temperature field analysis can be adjusted to the appropriate issue. The following modules may help you:

To calculate thermal conductivity and radiation in order to identify temperature distributions and thermal fows:

The convection will be defined by analytically derivable heat transfer conditions quality to achieve good results and a high degree of calculation speed.

For a detailed understanding of the physical processes with the goal of the exact modeling of heat conduction, radiation, and convection, as well as some local effects such as for heating and cooling systems or HVAC.

A specialized tool for simulating entire systems – from complex semiconductor chips to circuit boards to the entire device, you can optimize thermal management with library modules and a scalable degree of detail. Data from ECAD and MCAD systems is loaded and aggregated, depending on the selected degree of detail. Conducting rails are provided with homogenized, orthotropic material characteristics, depending on the layer structure and copper content. Typical components like fans, heat exchangers, and housing cut-outs are put together using intelligent modules.

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